INFLUENCE OF AZOLE STABILIZERS ON AN ECOFRIENDLY ELECTROLESS COPPER NANO THIN FILM DEPOSITION
Keywords:azole stabilizers, dimethylamineborane, glycerol, nano thin film, surface roughness
In this study the effects of azole stabilizers, viz., benzotriazole (BTA) and 2-Mercaptobenzothiazole (2-MBT) on electroless deposition of copper nano thin film from glycerol containing eco-friendly copper methanesulphonate bath were studied. Dimethylamineborane (DMAB) was used as reducing agent and potassium hydroxide (KOH) was used as pH adjustor. The electroless bath was optimized by addition of 1 ppm concentration of stabilizers at 13.0. Surface morphology and structural property of copper deposits were studied by atomic force microscopy (AFM) and x-ray diffraction (XRD) method. Electrochemical and corrosion kinetic properties were analyzed by cyclic voltammetry (CV).2-Mercaptobenzothiazole was found to inhibit copper deposition while benzotriazole accelerated it. The crystallite size and surface roughness values were found to nano thin film deposition. Benzotriazole resulted in better physical and electrochemical properties of copper deposits than glycerol plain bath and 2-Mercaptobenzothiazole.
I. Ababneh, A., Sheban, M., Abu-Dalo, M., and Andreescu S. (2009). ‘Effect of benzotriazole derivatives on steel corrosion in solution simulated carbonated concrete’. Jordan journal of civil engineering, Vol. 3, pp. 91-102.
II. Antonijevic, M M. and Petrovic, M B. (2008). ‘Copper Corrosion Inhibitors. A review’, Int. J. Electrochem. Sci, Vol. 3, pp.1-28.
III. Balci, S., Bittner, A M., Hahn, K., Scheu, C., Knez, M., Kadri, A., Wege, C., Jeske. H. and Kern, K. (2006). ElectrochimicaActa, 51, 6251-6257.
IV. Chadwick, D. and Hashemi, T. (1978). ‘Adsorbed corrosion inhibitors studied by electron spectroscopy: Benzotriazole on copper and copper alloys’. Corrosion Science, Vol.18, pp. 39-51.
V. Chen-Yu Kao. and Kan-Sen Chou. (2007). ‘Electroless copper plating onto printed lines of nanosized silver seeds electrochem’. Solid-State Lett, Vol. 10, pp.D32-D34.
VI. Cho Sang Jin., Nguyen Trieu. and Boo Jin Hyo. (2011). ‘Polyimide surface modification by using microwave plasma for adhesion enhancement of copper electroless plating’. Journal of nanoscience and nanotechnology, Vol.11, pp. 5328-5333.
VII. Debye, P. and Scherrer, P. (1916). ‘Interference of irregularly oriented particles in x-rays.’ Phys. Ziet, Vol. 17, pp.277-283.
VIII. Fox, P G., Lewis, G. and Boden, P J. (1979). ‘Some chemical aspects of the corrosion inhibition of copper by benzotriazole’. Corrosion Science., Vol.19, pp. 457-467.
IX. Huang, Q., Gu, M Y. and Jin, Y P. (2000). ‘Electronic packaging materials research. Materials Review., Vol. 114, pp. 28-30.
X. Kahled, K F. (2009). ‘Experimental and atomistic simulation studies of corrosion inhibition of copper by a new benzotriazole derivative in acid medium’.ElectrochimicaActa., Vol. 54, pp. 4345-4352.
XI. Khaled, K F., Fadl Allah, S A. and Hammouti, B. (2009). ‘Some benzotriazole derivatives as corrosion inhibitors for copper in acidic medium: Experimental and quantum chemical molecular dynamics approach’. Mat., Chem., and Phys., Vol. 117, pp. 148-155.
XII. Ohno, I. (1991). ‘Electrochemistry of electroless plating’. J. Mat. Sci. Eng., Vol. 146, pp. 33-49.
XIII. Rohan, J F., Casey, D P., Ahern, B M., Rhen, F M F., Roy, S., Fleming, D., and Lawrence, S E. (2008). ‘Electrochem. Commun, 10, 1419-1422.
XIV. Schlesinger, M. and Paunovic, M. (2000). ‘Modern electroplating’. 4th edition, New York, John Wiley, Vol. 14, pp. 868.
XV. Schlesinger, M., (Editor). and Paunovic, M., (Editor). (2010). ‘Modern Electroplating’. 5th Edition, New York, John Wiley, pp. 736.
XVI. Schneble, F W. and Zeblisky, R J. (1966). U.S.Patent. 3,257,215.
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